J-STD-002C PDF

Mausar This standard describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This is intended to facilitate access to the applicable documents when working with electronic hardware. It is used to determine what classification level should be used for initial reliability qualification. Mechanical Standardization 2 Apply JC This test method is applicable for inspection and device characterization. Stress 1 Apply Thermal. Mechanical Standardization filter JC These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.

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This test method is considered destructive, and is intended primarily for device qualification. Plastic SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing qualification and reliability monitoring to evaluate long term reliability.

The objective is to provide reliable, repeatable HBM ESD test results so that accurate classifications can be performed. The objective is to provide reliable, repeatable MM ESD test results so that accurate classifications can be performed.

External visual is a nondestructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. It also provides optional conditions for aging and soldering for the purpose of allowing simulation of the soldering process to be used in the device applications.

It provides procedures for dip and look solderability testing of through hole, axial and surface mount devices and simulated reflow testing for surface mount packages. This is a destructive test that is intended for component qualification. This is a destructive test intended for device qualification, and is normally applicable to cavity-type packages.

For hermetic packages it is recommended that this test be followed by hermeticity tests in accordance with Test Method A to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. This test, including each of its test conditions, is considered destructive and is only recommended for qualification testing. This test is applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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